Our catalog offers the full range of products with tailored morphologies and microstructures and handling characteristics to match your needs for orthopedic surgery and bone tissue engineering.

Our synthetic product line, Cem-Ostetic®, Bi-Ostetic™, and GenerOs™ bone void fillers, are based on hydroxyapatite (HAP) and tricalcium phosphate (TCP) technologies. These products are available in granule, block and injectable putty formulations. They are approved for sale in the USA, the European Union, and a number of other countries in Asia and South America.

Berkeley Advanced Biomaterials has developed unique technology to manufacture DBM putty, gel, crunch, and strips that contain no additives (100% allograft). The pure DBM line of products has the advantage of eliminating the need for non-active carriers, while still retaining great handling characteristics.

For further information, please refer to our Catalog.